Wire Bonder AOI

Our independent research and development, manufacturing of high performance, high stability, high yield of gold line visual detection machine. Manually put the products in the Cassette and finished wire bonder into the equipment. The device will automatically import the sheet into the testing platform for testing. After testing, the product will be put into another empty Cassette, and the test result will be generated and exported.

Equipment advantages

• 01

  Type of frame to check：QFN、sop、FOCL、LGA

• 02

  Image pixel accuracy：5μm

• 03

  Appearance defect detection rate：DB 80%；WB 75%

• 04

  DB defect: wrong die, die off, offset, damage, dirty

• 05

  WB defect：Welding ball falling off, welding ball offset, spherical anomaly

• 06

  welding wire bending, welding wire short circuit

• 07

  Substrate defect：Deformation, silver glue

Basic information

Equipment size:≧1700 X1000 X 1600(1870) mm	Machine weight: about 950kg
Working voltage:220 V、Working air pressure: 0.4~0.7 Mpa	Suitable Scope:breadth:40mm~90mm，length<300mm
Index  accuracy:±0.05mm	Substrate positioning accuracy:士0.05mm
UPH:40s-80s/panel